Power Master Semiconductor released TOLL Package for Enhanced Thermal Performance, Improved Switching Performance and Power Density for 600V e MOS E7 Portfolio
Power Master
Semiconductor has released a new package portfolio, TO leadless (TOLL) package
for 600V e MOS E7 series to
meet the increasing demands for high power density with superior switching performance
in various applications such as servers, telecom infrastructure, flat panel
display power, ESS, and battery formations.
The TOLL package has a
footprint of 9.9mm x 11.7mm, reducing the PCB area by 30% compared to the D2PAK
7-lead package. Moreover, with a thickness of 2.3mm, it has 60% less height
than the D2PAK 7-lead package. The TOLL offers superior thermal performance and
low package inductance (2nH) compared to D2PAK 7-lead package.Kelvin source configuration
lowers gate noise and reduces turn-on loss by 60% compared to same device
without Kelvin source configuration, enabling higher frequency operation and
improved power density. PMT60N105E7 has a VDSS rating of 600 V with
a maximum RDS(ON) of 105 mΩ and a maximum drain current (ID)
of 31 A.All Power Master Semiconductor’s products in TOLL package
has wettable flanks in the gate and source pins to enhance the performance of
the solder joint and offers Moisture Sensitivity Level 1 (MSL 1). About Power Master SemiconductorPower Master Semiconductor, is comprised of a team of
experts with over 20 years of experience in power semiconductor design,
production, application, technology, and marketing at Samsung, Fairchild and
onsemi. Since our establishment in January 2018, we have been focused on the design,
production, and mass production of SiC Diode/MOSFET and SJ MOSFET as a domestic
power integrated semiconductor company. Our headquarters and FAB are located in
Cheongju, Chungcheongbuk-do, with R&D facilities in Gyeyang, Incheon in
Korea. We have been developing SJ and SiC products as our major focus, and are
continuously increasing our capacity by developing and mass-producing products
comparable to major SiC competitors.