Unit Process Service
Unit Process Service WAFER Service

Unit Process Service

PMS possess following processes

ㆍ8 inch Silicon
- Stacked EPI technology
- Wafer thinning technology

ㆍ6 inch SiC
- High Temperature/High Current implant technology
- High Temperature Anneal/HT Oxidation technology
- Exclusive SiC Trench technology

  • 8인치 Silicon 단위공정: EPI 성장기술

  • 8인치 Silicon 단위공정: 반도체 후공정

  • 6인치 SiC 단위공정: 반도체 전공정