Unit Process Service
Unit Process Service WAFER Service

Unit Process Service

PMS possess following processes

ㆍ8 inch Silicon
- Stacked EPI technology
- Wafer thinning technology

ㆍ6 inch SiC
- High Temperature/High Current implant technology
- High Temperature Anneal/HT Oxidation technology
- Exclusive SiC Trench technology

  • 8 inch Silicon unit process: EPI development technology

  • 8 inch Silicon unit process: Back-end processing

  • 6 inch SiC unit process: front-end processing